Half-size breadboards are handy for most projects, and these versions include interlocking sections meaning you can join lots of these together to scale up for larger projects.

Thistransparent400-point solderless breadboard features two 50-point power rails and a 30×10 point prototyping grid.

Pins are spaced by 2.54mm with a centre separation for separating DIP package chips. The rear of the board is self-adhesive for sticking to your project.

Also available in white. Don’t forget to grab somejumper wiresfor connecting your components together.

Specifications

• Transparent ABS plastic allows you to see the inner connections of the breadboard
• 400 total tie-points:
  • 300 general prototyping tie-points
    • 2 columns of 30 rows of 5 interconnected tie-points
  • 100 power rail tie-points
    • 2 pairs of positive and negative power rails, one pair on each side of the breadboard
      • 25 interconnected tie-points per rail
• The two columns have a 0.3″ (7.62mm) separation which allows for easy placement of DIP style package ICs
• Board-to-board side connectors on all four sides allow you to connect multiple breadboards together to form larger breadboards
  • The power rail pairs are attached to the main board with the same board-to-board connectors
    • You can remove the power rails from the main breadboard and cut the adhesive foam backing to make a smaller breadboard and independent power rail pairs
• Peel away paper protected self-adhesive foam backing to mount to projects or mounting plates
• For added fun use LEDs to illuminate the body of the breadboard
• Hole Spacing: 2.54mm (0.1″)
• Acceptable Pin Sizes: 29-21 AWG
• Contacts: 2.54mm (0.1″)
• Material: Nickel plated brass
• Rated Amperage: 2A
• Dimensions
  • Length 82.55mm (3.25″)
  • Width 54.61mm (2.15″)
  • Height 8.38mm (0.33″)

* Excluding the board-to-board side connectors and adhesive foam backing